LinkTron
LinkTron
Coverlay, 3Layer FPCB, Bonding Sheet, EMI Shield Film
LinkTron is a brand name for FPCB material of 
Corporation.
Product Info.
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Domestic General-Purpose
FPCB Material M/S No.1 -
Electromagnetic-
Wave-Shielding Film
Product Line Construction
of Full Line-Up -
Continuous
Investment in
Development of
New Product
Coverlay, FCCL (Flexible Copper Clad Laminate) and Bonding Sheet are the main materials for FPCB (Flexible Printed Circuit Board) composed of Polyimide film(insulation film), copper foil and special adhesives. FPCB, Flexible Printed Circuit Board: It is used for digital electronic devices that require lightweight thinning, high densification, flexibility and repeatability. It is a concept corresponding to a rigid board that uses paper phenol or glass epoxy (general printed circuit board (PCB)) as the raw materials.
Application
Type and Structure
Mass Product Line Up
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3Layer FCCL
Conventional
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Slim 3Layer FCCL
Can be used in Fabrication of FPC.
cf) COG, COF
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Transparent FCCL
Consists of Transparent Film, Adhesive and Copper Foil
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Coverlay, Slim Coverlay
Can be used to Protection and Insulation Layer for FPCB and has Low Spring Back Properties
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Black Coverlay
Black PI type Coverlay
Black Adhesive type Coverlay
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White Coverlay
White type Coverlay for LED BLU Device.
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Anti Ion-migration Coverlay
Excellent Insulation Resistance at High Temperature and
Humidity. Raw Material for HDD, CD-ROM pick up and
Fine Pattern.
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Transparent Coverlay
Consists of Transparent Film(PET, PEN, PI) and Adhesive.
Can be used to Lighting for Advertising,
Transparent Display and TSP etc.
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Bonding Sheet(Anti Ion-migration)
Can be used to make the Multi-Layer FPC.
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PI Stiffener
Can be used for Supporting and
Protecting FPC Products.
EMI Product Line Up
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EMI Shielding Film, CNT-EMI Shielding Film
Prevent Electromagnetic Interference Noise.
Increase Transmitted Signal Speeds.
Thin & Thick Type
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EMI Absorber Film
Excellent EMI Absorbing Effects using the High Quality soft Magnetic Metal Powder.
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Conductive Double Sided Tape(CDT)
Can be used for Supporting and Protecting FPC Products by Metal Stiffener and has Shielding Effects.
High Frequency Product Line Up
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SCF(High Frequency FCCL)
Consists of PI film and modified Cu. Low Initial Insertion
Signal Loss.
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High Frequency EMI
High shielding performance in wide band range. Low Initial
Insertion Signal Loss. High conductivity.
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EMI-GND Expansion Film
Increase Thermal Radiation & Grounding
Good Contact Resistance & Inherent Superior Noise Suppression
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Low Dk Bonding Sheet
Impedance Control.
Reduction of transmission loss.
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Low Dk Coverlay
Impedance Control.
Reduction of transmission loss.
Automotive Product Line Up
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PEN / PET FCCL
FCCL which consists of polyester film (e.g. PEN, PET film), Adhesive and copper
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PEN/PET Coverlay
Insulation film which consists of polyester film (e.g. PEN or
PET Film) and adhesive
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High Tg Adhesive
High-reliable adhesive for automative operating temperature (-40℃~125℃)
Production Process
Usage Diagram
Raw Materials
- PI
- SKCKOLON PI
- Copper Foil
- ILJIN
- LS Mtron
JAPAN
- PI
- KANEKA
- UBE
- Copper Foil
- NIKKO
- MITSUI
- FUKUDA
ETC
- PI
- DUPONT(美)
- TAIMIDE(臺)
- Copper Foil
- CFL(Luxembourg)
FCCL
- Hanwha Solutions/Advanced Materials
- INNOX Advanced Materials
- Doosan Corporation Electro-Materials
JAPAN
- ARISAWA
- SHIN-ETSU
- NIKKAN
- Toyo
CHINA/TAIWAN
- TAI-FLEX
- MICROCOSM
- FangBang
- Thin-Flex
- ROGERS
- Dongyi
FPCB
- Interflex
- BHflex
- YP Electronics
- SI Flex
JAPAN
- MekTron
- FUJIKURA
- SUMITOMO
CHINA/TAIWAN
- GLOBAL FLEX
- CAREER
- Unimicron
- Multek
- FOXCONN
MODULE
- Display
- SAMSUNG Display
- LG Display
- MELFAS
- Camera
- SAMSUNG ELECTRO MECHANICS
- LG Innotek
- CAMMSYS
- NAMUGA
- Wireless Recharge Technology
- AMOTECH
- SAMSUNG ELECTRO MECHANICS
- Hansol Technics
- CHEMTRONICS
SET Marker
KOREA
- SAMSUNG ELECTRO MECHANICS
- LG Electronics
EUROPE /
NORTH AMERICA
- Apple
- MOTOROLA
- Nokia
CHINA/TAIWAN
- Hauwei
- Oppo/Vivo
- BenQ
- ZTE
- TCL
Technical Data
There is no data.