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LinkTron

LinkTron

Coverlay, 3Layer FPCB, Bonding Sheet, EMI Shield Film

LinkTron is a brand name for FPCB material of Hanwha Advanced Materials Corporation.

Product Info.

  • Domestic General-Purpose
    FPCB Material M/S
    No.1
  • Electromagnetic-
    Wave-Shielding Film
    Product Line
    Construction
    of Full Line-Up
  • Continuous Investment in
    Development of
    New Product

Coverlay, FCCL (Flexible Copper Clad Laminate) and Bonding Sheet are the main materials for FPCB (Flexible Printed Circuit Board) composed of Polyimide film(insulation film), copper foil and special adhesives. FPCB, Flexible Printed Circuit Board: It is used for digital electronic devices that require lightweight thinning, high densification, flexibility and repeatability. It is a concept corresponding to a rigid board that uses paper phenol or glass epoxy (general printed circuit board (PCB)) as the raw materials.

Application

Application image

Type and Structure

Mass Product Line Up
  • 3Layer FCCL

    Conventional

    PI Film > Adhesive > Copper Foil
  • Slim 3Layer FCCL

    Can be used in Fabrication of FPC.
    cf) COG, COF

    PI Film > Adhesive > Copper Foil
  • Transparent FCCL

    Consists of Transparent Film, Adhesive and Copper Foil

    Transparent Film > Transparent Adhesive > Copper Foil
  • Coverlay, Slim Coverlay

    Can be used to Protection and Insulation Layer for FPCB and has Low Spring Back Properties

    PI Film > Adhesive > Release Paper
  • Black Coverlay

    Black PI type Coverlay
    Black Adhesive type Coverlay

    Release Paper > Black Adhesive > Release Paper
  • White Coverlay

    White type Coverlay for LED BLU Device.

    White Layer > PI Film > Adhesive > Release Paper
  • Anti Ion-migration Coverlay

    Excellent Insulation Resistance at High Temperature and
    Humidity. Raw Material for HDD, CD-ROM pick up and
    Fine Pattern.

    PI Film > Adhesive > Release Paper
  • Transparent Coverlay

    Consists of Transparent Film(PET, PEN, PI) and Adhesive.
    Can be used to Lighting for Advertising,
    Transparent Display and TSP etc.

    Transparent Film > Transparent Adhesive > Release Paper
  • Bonding Sheet(Anti Ion-migration)

    Can be used to make the Multi-Layer FPC.

    Release PET Film > Adhesive > Release Paper
  • PI Stiffener

    Can be used for Supporting and
    Protecting FPC Products.

    Thick PI Film > Adhesive > Release Paper
EMI Product Line Up
  • EMI Shielding Film, CNT-EMI Shielding Film

    Prevent Electromagnetic Interference Noise.
    Increase Transmitted Signal Speeds.
    Thin & Thick Type

    White Matt PET > Insulation Layer > Conductive Adhesive > Transparent Release Film
  • EMI Absorber Film

    Excellent EMI Absorbing Effects using the High Quality soft Magnetic Metal Powder.

    EMI Absorber Film - Magnetic Metal Powder
  • Conductive Double Sided Tape(CDT)

    Can be used for Supporting and Protecting FPC Products by Metal Stiffener and has Shielding Effects.

    Conductive Adhesive > White Release Film
High Frequency Product Line Up
  • SCF(High Frequency FCCL)

    Consists of PI film and modified Cu. Low Initial Insertion
    Signal Loss.

    Copper Foil > Pi film > Copper Foil
  • High Frequency EMI

    High shielding performance in wide band range. Low Initial
    Insertion Signal Loss. High conductivity.

    White Matt PET > Insulation Layer > Copper Foil > Conductive Adhesive > Transparent Release Film
  • EMI-GND Expansion Film

    Increase Thermal Radiation & Grounding
    Good Contact Resistance & Inherent Superior Noise Suppression

    Protection Film > Metal : Aluminum > Metal : Copper > Conductive Adhesive > Release Film
  • Low Dk Bonding Sheet

    Impedance Control.
    Reduction of transmission loss.

    Release PET  Film > Adhesive > Release Paper
  • Low Dk Coverlay

    Impedance Control.
    Reduction of transmission loss.

    PI Film > Adhesive > Release Paper
Automotive Product Line Up
  • PEN / PET FCCL

    FCCL which consists of polyester film (e.g. PEN, PET film), Adhesive and copper

    PEN (or PET) Film > Transparent Adhesive > Copper Foil
  • PEN/PET Coverlay

    Insulation film which consists of polyester film (e.g. PEN or
    PET Film) and adhesive

    PEN, PET Film > Adhesive > Release Paper
  • High Tg Adhesive

    High-reliable adhesive for automative operating temperature (-40℃~125℃)

    Copper Foil > Pi film > Copper Foil

Production Process

Mixing > Coating > Laminating > Heating > Slitting > Final Products

Usage Diagram

Raw Materials
PI
SKCKOLON PI
Copper Foil
ILJIN
LS Mtron
JAPAN
PI
KANEKA
UBE
Copper Foil
NIKKO
MITSUI
FUKUDA
ETC
PI
DUPONT(美)
TAIMIDE(臺)
Copper Foil
CFL(Luxembourg)
FCCL
  • Hanwha Advanced Materials
  • INNOX Advanced Materials
  • Doosan Corporation Electro-Materials
JAPAN
  • ARISAWA
  • SHIN-ETSU
  • NIKKAN
  • Toyo
CHINA/TAIWAN
  • TAI-FLEX
  • MICROCOSM
  • FangBang
  • Thin-Flex
  • ROGERS
  • Dongyi
FPCB
  • Interflex
  • BHflex
  • YP Electronics
  • SI Flex
JAPAN
  • MekTron
  • FUJIKURA
  • SUMITOMO
CHINA/TAIWAN
  • GLOBAL FLEX
  • CAREER
  • Unimicron
  • Multek
  • FOXCONN
MODULE
Display
SAMSUNG Display
LG Display
MELFAS
Camera
SAMSUNG ELECTRO MECHANICS
LG Innotek
CAMMSYS
NAMUGA
Wireless Recharge Technology
AMOTECH
SAMSUNG ELECTRO MECHANICS
Hansol Technics
CHEMTRONICS
SET Marker
KOREA
  • SAMSUNG ELECTRO MECHANICS
  • LG Electronics
EUROPE /
NORTH AMERICA
  • Apple
  • Google
  • MOTOROLA
  • Nokia
CHINA/TAIWAN
  • Hauwei
  • Oppo/Vivo
  • BenQ
  • ZTE
  • TCL

Technical Data

There is no data.

Inquiries

LinkTron_KOREA
Name
Jang Jaehoon
Mobile
010.9702.6377
E-mail
jjh05@hanwha.com
LinkTron_GLOBAL
Name
Joe Yoon
Mobile
010.2632.2394
E-mail
yinzhihu@hanwha.com