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R&D

Innovation for a Brighter Tomorrow

We are committed to protecting the values of humanity and the environment,
and we seek to provide products of utmost quality and state-of-the-art R&D solutions.

Many of the leading advanced materials technologies we have developed over the past three decades can be found all around us, from lighter cars and ever more convenient digital devices, to highly efficient solar energy sources. We are constantly developing and acquiring unique and innovative technologies that can strengthen the competitiveness of the three key industry segments we focus on, automotive, electronics, and solar. We are expanding our business lines by diversifying into lightweight composite materials and developing more advanced thermoforming technologies. We are also developing high-function/high-quality film materials that will drive the market forward.

Lightweight Composite Materials Development Center

Leading the global automotive light-weighting trend, the Lightweight Composite Materials Development Center focuses on
securing competitiveness through integrated technologies from materials to final products, with the ability to design and develop
thermoplastic/thermosetting composite materials and molding technologies.

Vision

R&D that leads global leading materials/components companies

R&D Area
Molding
Process
  • Processes : Compression, Thermo-stamping Injection, PCM, Hybrid Molding
  • Process Design and Optimization
Materials
  • Materials : CFRTPC, LWRT, Carbon
    Composites, Functional Composites,
    Microcellular Materials
  • Formulation and Manufacturing Process
Application
  • Applications : Crash, Semi-structural & Structural Exterior Body Panel, Interior
  • Design & Analysis, Assembly, Evaluation
Major R&D Area
Focus Field

Thermoplastic Composites, Thermoset Composites, New Application structure table

Thermoplastic Composites
Structural
LFT-G
Injection Molding, Thermo-stamping
CFRTPC
Thermo-stamping
Lightweight
LWRT
Thermo-stamping
Functional
Conductive
Injection Molding
Thermoset Composites
Structural
SMC CF-SMC
Compression
Carbon Composites
HP-RTM/WCM
PCM
New Application
Hybrid
IM Electronic
Insert Molding
Circuit Layout
Major Roles of Research Center
Material development
  • Material development - Multipurpose TPC imageMultipurpose TPC
  • Material development - CF- SMC Sheet imageCF- SMC Sheet
  • Material development - Compound imageCompound
Development of molding process
  • Development of molding process - Thermoforming imageThermoforming
  • Development of molding process - Press imagePress
  • Development of molding process - Injection imageInjection
Product design
  • Product design - Component design using CATIA imageComponent design using CATIA
  • Product design - Design of FEM carrier imageDesign of FEM carrier
  • Product design - Collision analysis imageCollision analysis
  • Product design - Collision analysis imageCollision analysis
Product molding assembly
Product molding assembly image
Test evaluation
Test evaluation - Bumper/seat collision test imageBumper/seat collision test
Performance
Thermoplastic Composite
CFRTPC, LWRT, LFT-G, Conductive Composite
Thermoset Composite
SMC, Carbon Fiber SMC, Carbon Composite
Application
Partition Panel, Front End Carrier, Stiffener, Front Bumper Beam, Overhead Console, Electrical Component Housing, Front Seat Back, Battery Cover, Tail Gate, Rear Bumper Beam
Lightweight Composite Materials Development Center Lightweight Composite Materials Development Center
Location
address
155, Gongdan-ro, Yeonseo-myeon,
Sejong-si, 30058, Republic of Korea
TEL
82.44.410.3000
FAX
82.44.410.3050

Solar Materials Development Center

After entering the solar materials field through the development of sheet material for solar module and commercial production, we are concentrating on sheet development for new materials/structures. We are expanding our production area with solar cells and module materials such as next-generation interconnection materials and electrode materials.

Vision

Development of new material and provision of customized solutions
through expansion of platform technology

R&D Area

Glass > EVA Sheet > Solar Cells > EVA Sheet > BackSheet

Photovoltaic Ag Paste
PV Ag Paste is electrode materials for electric current generated by solar cells.
HAMC’s PV Ag Paste shows lower contact resistance, lower line conductivity and higher adhesion strength.
HAMC’s PV Ag Paste is the best choice for high efficiency solar cells.
PV Electrode Sheet
PV electrode sheet ,the round shaped PV wire attached on EVA sheet, enables 60 cells soldering simultaneous in module lamination process.
Distributed 12 wires increase module power by reducing the light shading and series resistance.
Performance
BackSheet
Diversification of material methods : PET, fluorine, olefin series and coater lamination, multilayer extrusion, etc.
Solar Materials Development Center Solar Materials Development Center
Location
address
1329, Daegeum-ro, Geumwang-eup,
Eumseong-gun,Chungcheongbuk-do, 27632,
Republic of Korea
TEL
82.43.880.2000
FAX
82.43.880.2109

Electronic Materials Development Center

The Electronic Materials Development Center, which is specialized in the localization of FCCL materials, is focusing on circuit materials for mobile devices and electric parts, and circuit materials for next generation products such as 5th generation mobile communications and IoT devices.

Vision

Development of full line up of the highest-quality
and flexible circuit material products

R&D Area
Flexible Copper Clad Laminate > Flexible Printed Circuit Board
Status
LinkTron R&D Status structure table
LinkTron R&D
* : Product undergoing upgrade
Colorlay / CCL
* Low Dk C/L
Low Dk B/S
FCCL for high-frequency (SCF)
EMI Shield Product
* EMI Shield Film for high-frequency
GND Expansion Film
Automotive Product
PEN C/L for high humidity
PEN 3L FCCL for high humidity
* High Tg adhesive for high temperature
Information about LinkTron
Coverlay / CCL
Low-Dk C/L
Mobile FCPB mainly requires insulating film for insulation from the
surroundings. This insulation film is called "Cover-Lay".
In order to use it for the 5th generation mobile communication,
there is a characteristic that only the signal loss is about 3%

Low-Dk C/L - PI > Film Adhesive > Release Paper

Low-Dk B/S
In order to use it for 5G mobile communication, Hanwha is being
developed as follows. Particularly, it is resistant to moisture and its
adhesive ability as an adhesive agent for a long period of time is
called "ion migration"
Hanwha have improved "signal loss" and "ion migration"
characteristics simultaneously.

Low-Dk B/S - Release PET Film > Adhesive > Release Paper

SCF(High Frequency FCCL)
As the core material of 5G, it has the same reliability and mass
productivity as the existing FCCL and has minimized transmis-
sion loss at 28GHz Completed development of FCCL.
In particular, it is possible to realize fine patterns that are
essential to future FPCBs while realizing high-speed transmis-
sion characteristics.

SCF(High Frequency FCCL) - Copper Foil > Pi film > Copper Foil

EMI Shielding Product
High Frequency EMI
High shielding performance in wide band range.
Low Initial Insertion Signal Loss.
1) EMI shielding capability has been improved over existing
EMI shield film
2) Significantly improved 5th generation mobile
communication signal loss.

High Frequency EMI - White Matt PET > Insulation Layer > Copper Foil > Conductive Adhesive > Transparent Release Film

EMI-GND Expansion Film
High shielding performance in wide band range.
Low Initial Insertion Signal Loss.
1) EMI shielding capability has been improved over existing
EMI shield film
2) Significantly improved 5th generation mobile
communication signal loss.

EMI-GND Expansion Film - Protection Film > Metal : Aluminum > Metal : Copper > Conductive Adhesive > Release Film

Automotive Product
PEN/PET Coverlay
Insulation film which consists of polyester film
(e.g. PEN or PET Film) and adhesive.
Unlike mobile phones, PEN film is used instead of
PI film for automobiles.
Because It is advantageous for moisture and carbon dioxide
generation during burning is advantageous compared to PI film

PEN/PET Coverlay - PEN, PET Film > Adhesive > Release Paper

PEN / PET FCCL
FCCL which consists of polyester film (e.g. PEN, PET film),
Adhesive and copper.
Unlike mobile phones, PEN film is used instead of
PI film for automobiles.
Because It is advantageous for moisture and carbon dioxide
generation during burning is advantageous compared to PI film

PEN / PET FCCL - PEN (or PET) Film > Transparent Adhesive > Copper Foil

High Tg Adhesive
High-reliable adhesive for automative operating
temperature (-40℃~125℃)
The environment for automobile is different from that of
mobile, so it requires high reliability and high heat resistance
characteristics

High Tg Adhesive - Copper Foil > Pi film > Copper Foil

Location
address
79-20, Geumhoangol-gil, Bugang-myeon,
Sejong-si, 30077, Republic of Korea
TEL
82.44.279.8543
FAX
82.44.279.8540