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电子材料

LinkTron

Coverlay, 3Layer FPCB, Bonding Sheet, EMI Shield Film

LinkTron是韩华高新材料所开发的用于FPCB的材料品牌名称。

产品资讯

  • 韩国通用FPCB材料
    材料M/S
    第一
  • 构建电磁波
    屏蔽膜产品群
    Full Line-Up
  • 坚持不懈 投资新
    产品开发

Coverlay、FCCL(Flexible Copper Clad Laminate)、Bonding Sheet是由聚酰亚胺膜(Polyimide film)、铜箔、特殊粘合剂组成、用于柔性线路板(FPCB、Flexible Printed Circuit Board)的主要材料。
柔性线路板:有别于一般印制电路板(PCB)Paper Phenol与以Glass Epoxy为原料制成的Rigid基板、主要用于要求具有轻薄短小、高密度、柔软性、弯曲性、反复性等特性的数码电子设备等领域。

Application

Application

种类与结构

Mass Product Line Up
  • 3Layer FCCL

    Conventional

    PI Film > Adhesive > Copper Foil
  • Slim 3Layer FCCL

    Can be used in Fabrication of FPC.
    cf) COG, COF

    PI Film > Adhesive > Copper Foil
  • Transparent FCCL

    Consists of Transparent Film, Adhesive and Copper Foil

    Transparent Film > Transparent Adhesive > Copper Foil
  • Coverlay, Slim Coverlay

    Can be used to Protection and Insulation Layer for FPCB and has Low Spring Back Properties

    PI Film > Adhesive > Release Paper
  • Black Coverlay

    Black PI type Coverlay
    Black Adhesive type Coverlay

    Release Paper > Black Adhesive > Release Paper
  • White Coverlay

    White type Coverlay for LED BLU Device.

    White Layer > PI Film > Adhesive > Release Paper
  • Anti Ion-migration Coverlay

    Excellent Insulation Resistance at High Temperature and
    Humidity. Raw Material for HDD, CD-ROM pick up and
    Fine Pattern.

    PI Film > Adhesive > Release Paper
  • Transparent Coverlay

    Consists of Transparent Film(PET, PEN, PI) and Adhesive.
    Can be used to Lighting for Advertising,
    Transparent Display and TSP etc.

    Transparent Film > Transparent Adhesive > Release Paper
  • Bonding Sheet(Anti Ion-migration)

    Can be used to make the Multi-Layer FPC.

    Release PET Film > Adhesive > Release Paper
  • PI Stiffener

    Can be used for Supporting and
    Protecting FPC Products.

    Thick PI Film > Adhesive > Release Paper
EMI Product Line Up
  • EMI Shielding Film, CNT-EMI Shielding Film

    Prevent Electromagnetic Interference Noise.
    Increase Transmitted Signal Speeds.
    Thin & Thick Type

    White Matt PET > Insulation Layer > Conductive Adhesive > Transparent Release Film
  • EMI Absorber Film

    Excellent EMI Absorbing Effects using the High Quality soft Magnetic Metal Powder.

    EMI Absorber Film - Magnetic Metal Powder
  • Conductive Double Sided Tape(CDT)

    Can be used for Supporting and Protecting FPC Products by Metal Stiffener and has Shielding Effects.

    Conductive Adhesive > White Release Film
High Frequency Product Line Up
  • SCF(High Frequency FCCL)

    Consists of PI film and modified Cu. Low Initial Insertion
    Signal Loss.

    Copper Foil > Pi film > Copper Foil
  • High Frequency EMI

    High shielding performance in wide band range. Low Initial
    Insertion Signal Loss. High conductivity.

    White Matt PET > Insulation Layer > Copper Foil > Conductive Adhesive > Transparent Release Film
  • EMI-GND Expansion Film

    Increase Thermal Radiation & Grounding
    Good Contact Resistance & Inherent Superior Noise Suppression

    Protection Film > Metal : Aluminum > Metal : Copper > Conductive Adhesive > Release Film
  • Low Dk Bonding Sheet

    Impedance Control.
    Reduction of transmission loss.

    Release PET  Film > Adhesive > Release Paper
  • Low Dk Coverlay

    Impedance Control.
    Reduction of transmission loss.

    PI Film > Adhesive > Release Paper
Automotive Product Line Up
  • PEN / PET FCCL

    FCCL which consists of polyester film (e.g. PEN, PET film), Adhesive and copper

    PEN (or PET) Film > Transparent Adhesive > Copper Foil
  • PEN/PET Coverlay

    Insulation film which consists of polyester film (e.g. PEN or
    PET Film) and adhesive

    PEN, PET Film > Adhesive > Release Paper
  • High Tg Adhesive

    High-reliable adhesive for automative operating temperature (-40℃~125℃)

    Copper Foil > Pi film > Copper Foil

生产流程

Mixing > Coating > Laminating > Heating > Slitting > Final Products

使用架构图

原材料
PI
SKCKOLON PI
Copper Foil
ILJIN
LS Mtron
日本
PI
KANEKA
UBE
Copper Foil
NIKKO
MITSUI
FUKUDA
ETC
PI
DUPONT(美)
TAIMIDE(臺)
Copper Foil
CFL(Luxembourg)
FCCL
  • Hanwha Advanced Materials
  • INNOX Advanced
    Materials
  • Doosan Corporation
    Electro-Materials
日本
  • ARISAWA
  • SHIN-ETSU
  • NIKKAN
  • Toyo
中国/台湾
  • TAI-FLEX
  • MICROCOSM
  • FangBang
  • Thin-Flex
  • ROGERS
  • Dongyi
FPCB
  • Interflex
  • BHflex
  • YP Electronics
  • SI Flex
日本
  • MekTron
  • FUJIKURA
  • SUMITOMO
中国/台湾
  • GLOBAL FLEX
  • CAREER
  • Unimicron
  • Multek
  • FOXCONN
MODULE
Display
SAMSUNG Display
LG Display
MELFAS
Camera
SAMSUNG ELECTRO
MECHANICS
LG Innotek
CAMMSYS
NAMUGA
Wireless Recharge Technology
AMOTECH
SAMSUNG ELECTRO
MECHANICS
CHEMTRONICS
SET Marker
韩国
  • SAMSUNG ELECTRO
    MECHANICS
  • LG Electronics
欧洲 / 北美
  • Apple
  • Google
  • MOTOROLA
  • Nokia
中国/台湾
  • Hauwei
  • Oppo/Vivo
  • BenQ
  • ZTE
  • TCL

技术资讯

There is no data.

产品咨询

LinkTron(KOREA)
名称
Jang Jaehoon
手机
010.9702.6377
电子邮件
jjh05@hanwha.com
LinkTron(GLOBAL)
名称
Joe Yoon
手机
010.2632.2394
电子邮件
yinzhihu@hanwha.com