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研发

为开创更美好的明天进行革新

作为坚守人与环境价值的高新材料技术企业、韩华高新材料提供最优质的产品与研发成果。

更轻巧的汽车、更高效的太阳能设备、以及更便利的信息通讯设备等、在我们周遭的每个领域、都能与韩华高新材料的先进材料技术邂逅。
韩华高新材料凭借轻量化复合材料的多样化、以及成型技术的开发、不断扩大事业领域、丰富产品种类、为了引领市场发展趋势、努力开发先进、
高品质的膜材。并以此为基础、不断增强在汽车、电子、能源领域的研究实力。

轻量复合材料中心

引领世界汽车轻量化发展趋势的轻量复合材料中心、不仅拥有热塑性 · 热固性复合材料及成型技术、还拥有精通设计、开发领域的优秀人才。
从材料到最终产品、其凭借整合的技术、致力于确保竞争力。

愿景

引领全球前沿材料、配件专业企业的研发

研究领域
Molding
Process
  • Processes : Compression, Thermo-stamping Injection, PCM, Hybrid Molding
  • Process Design and Optimization
Materials
  • Materials : CFRTPC, LWRT, Carbon
    Composites, Functional Composites,
    Microcellular Materials
  • Formulation and Manufacturing Process
Application
  • Applications : Crash, Semi-structural & Structural Exterior Body Panel, Interior
  • Design & Analysis, Assembly, Evaluation
主要研究领域
Focus Field

Thermoplastic Composites, Thermoset Composites, New Application structure table

Thermoplastic Composites
Structural
LFT-G
Injection Molding, Thermo-stamping
CFRTPC
Thermo-stamping
Lightweight
LWRT
Thermo-stamping
Functional
Conductive
Injection Molding
Thermoset Composites
Structural
SMC CF-SMC
Compression
Carbon Composites
HP-RTM/WCM
PCM
New Application
Hybrid
IM Electronic
Insert Molding
Circuit Layout
研究所主要工作
Material development
  • Material development - Multipurpose TPC imageMultipurpose TPC
  • Material development - CF- SMC Sheet imageCF- SMC Sheet
  • Material development - Compound imageCompound
Development of molding process
  • Development of molding process - Thermoforming imageThermoforming
  • Development of molding process - Press imagePress
  • Development of molding process - Injection imageInjection
Product design
  • Product design - Component design using CATIA imageComponent design using CATIA
  • Product design - Design of FEM carrier imageDesign of FEM carrier
  • Product design - Collision analysis imageCollision analysis
  • Product design - Collision analysis imageCollision analysis
Product molding assembly
Product molding assembly image
Test evaluation
Test evaluation - Bumper/seat collision test imageBumper/seat collision test
业绩
Thermoplastic Composite
CFRTPC, LWRT, LFT-G, Conductive Composite
Thermoset Composite
SMC, Carbon Fiber SMC, Carbon Composite
Application
Partition Panel, Front End Carrier, Stiffener, Front Bumper Beam, Overhead Console, Electrical Component Housing, Front Seat Back, Battery Cover, Tail Gate, Rear Bumper Beam
轻量复合材料中心 轻量复合材料中心
营业地点
address
155, Gongdan-ro, Yeonseo-myeon,
Sejong-si, 30058, Republic of Korea
TEL
82.44.410.3000
FAX
82.44.410.3050
地图链接
Lightweight Composite Materials Development Center map image

太阳能材料中心

自韩华高新材料开发用于太阳能组件的Sheet材料并实现商业化量产、成功进军太阳能材料领域以来、不断致力于开发能够适用新材料、新结构的Sheet、
努力扩大产品领域、潜心研发下一代Inter-connection材料、电极材料等太阳能电池及组件材料。

愿景

凭借扩张平台技术、开发新材料、提供定制化解决方案

研究领域

Glass > EVA Sheet > Solar Cells > EVA Sheet > BackSheet

Photovoltaic Ag Paste
PV Ag Paste is electrode materials for electric current generated by solar cells.
HAMC’s PV Ag Paste shows lower contact resistance, lower line conductivity and higher adhesion strength.
HAMC’s PV Ag Paste is the best choice for high efficiency solar cells.
PV Electrode Sheet
PV electrode sheet ,the round shaped PV wire attached on EVA sheet, enables 60 cells soldering simultaneous in module lamination process.
Distributed 12 wires increase module power by reducing the light shading and series resistance.
业绩
BackSheet
材料/工艺多样化:PET、氟、聚丙烯类及Coater复合、多层挤压等
太阳能材料中心 业绩 太阳能材料中心 业绩
营业地点
address
1329, Daegeum-ro, Geumwang-eup,
Eumseong-gun,Chungcheongbuk-do, 27632,
Republic of Korea
TEL
82.43.880.2000
FAX
82.43.880.2109
地图链接
Solar Materials Development Center map image

电子材料中心

电子材料中心凭借FCCL材料国产化、确保了他公司无可比拟的专业化竞争力。目前正致力于开发适用于移动设备及电子配件上的电路材料、
以及能够适用于下一代产品、即第五代移动通信与物联网设备的电路材料。

愿景

开发整套最优质的柔性(Flexible)电路产品系列

研究领域
Flexible Copper Clad Laminate > Flexible Printed Circuit Board
现状
LinkTron R&D 现状 structure table
LinkTron R&D
* : Product undergoing upgrade
Colorlay / CCL
* Low Dk C/L
Low Dk B/S
FCCL for high-frequency (SCF)
EMI Shield Product
* EMI Shield Film for high-frequency
GND Expansion Film
Automotive Product
PEN C/L for high humidity
PEN 3L FCCL for high humidity
* High Tg adhesive for high temperature
关于Linktron的信息
Coverlay / CCL
Low-Dk C/L
Mobile FCPB mainly requires insulating film for insulation from the
surroundings. This insulation film is called "Cover-Lay".
In order to use it for the 5th generation mobile communication,
there is a characteristic that only the signal loss is about 3%

Low-Dk C/L - PI > Film Adhesive > Release Paper

Low-Dk B/S
In order to use it for 5G mobile communication, Hanwha is being
developed as follows. Particularly, it is resistant to moisture and its
adhesive ability as an adhesive agent for a long period of time is
called "ion migration"
Hanwha have improved "signal loss" and "ion migration"
characteristics simultaneously.

Low-Dk B/S - Release PET Film > Adhesive > Release Paper

SCF(High Frequency FCCL)
As the core material of 5G, it has the same reliability and mass
productivity as the existing FCCL and has minimized transmis-
sion loss at 28GHz Completed development of FCCL.
In particular, it is possible to realize fine patterns that are
essential to future FPCBs while realizing high-speed transmis-
sion characteristics.

SCF(High Frequency FCCL) - Copper Foil > Pi film > Copper Foil

EMI Shielding Product
High Frequency EMI
High shielding performance in wide band range.
Low Initial Insertion Signal Loss.
1) EMI shielding capability has been improved over existing
EMI shield film
2) Significantly improved 5th generation mobile
communication signal loss.

High Frequency EMI - White Matt PET > Insulation Layer > Copper Foil > Conductive Adhesive > Transparent Release Film

EMI-GND Expansion Film
High shielding performance in wide band range.
Low Initial Insertion Signal Loss.
1) EMI shielding capability has been improved over existing
EMI shield film
2) Significantly improved 5th generation mobile
communication signal loss.

EMI-GND Expansion Film - Protection Film > Metal : Aluminum > Metal : Copper > Conductive Adhesive > Release Film

Automotive Product
PEN/PET Coverlay
Insulation film which consists of polyester film
(e.g. PEN or PET Film) and adhesive.
Unlike mobile phones, PEN film is used instead of
PI film for automobiles.
Because It is advantageous for moisture and carbon dioxide
generation during burning is advantageous compared to PI film

PEN/PET Coverlay - PEN, PET Film > Adhesive > Release Paper

PEN / PET FCCL
FCCL which consists of polyester film (e.g. PEN, PET film),
Adhesive and copper.
Unlike mobile phones, PEN film is used instead of
PI film for automobiles.
Because It is advantageous for moisture and carbon dioxide
generation during burning is advantageous compared to PI film

PEN / PET FCCL - PEN (or PET) Film > Transparent Adhesive > Copper Foil

High Tg Adhesive
High-reliable adhesive for automative operating
temperature (-40℃~125℃)
The environment for automobile is different from that of
mobile, so it requires high reliability and high heat resistance
characteristics

High Tg Adhesive - Copper Foil > Pi film > Copper Foil

营业地点
address
79-20, Geumhoangol-gil, Bugang-myeon,
Sejong-si, 30077, Republic of Korea
TEL
82.44.279.8543
FAX
82.44.279.8540
地图链接
Electronic Materials Development Center map image